REE: Report on the use of capital of bonds

Report on the use of capital of bonds of Refrigeration Electrical Engineering Corporation as follows:

HOSE

>   REE: Periodic report on bond interest & principal payment (24/08/2023)

>   More than US$240 million transacted one month after corporate bond platform launched (24/08/2023)

>   More than US$240 million transacted one month after corporate bond platform launched (24/08/2023)

>   VHM: Issuing bonds to the international market (23/08/2023)

>   LPB: Plan for the bond private placement in 2023 (23/08/2023)

>   HDB: Notice of bond redemption before maturity (22/08/2023)

>   LPB: Notice of the 3rd bond public offering (21/08/2023)

>   LPB: SSC received the documents of the 3rd bond public offering (21/08/2023)

>   LPB: Closing the list of bondholders to register securities at VSD (21/08/2023)

>   VDS: Plan for the 3rd bond issuance in 2023 (17/08/2023)