LPB: Plan for the bond private placement in 2023

Plan for the bond private placement in 2023 of Lien Viet Post Joint Stock Commercial Bank as follows:

HOSE

>   HDB: Notice of bond redemption before maturity (22/08/2023)

>   LPB: Notice of the 3rd bond public offering (21/08/2023)

>   LPB: SSC received the documents of the 3rd bond public offering (21/08/2023)

>   LPB: Closing the list of bondholders to register securities at VSD (21/08/2023)

>   VDS: Plan for the 3rd bond issuance in 2023 (17/08/2023)

>   HDB: Notice of bond redemption before maturity (17/08/2023)

>   PDR: Result of bond repurchase before maturity (16/08/2023)

>   MSB: Report on result of bond offering (15/08/2023)

>   CTG: CTG receives dossier of registration of bond public offering (09/08/2023)

>   VCI: Report on the use of capital of bonds (08/08/2023)