REE: BOD resolution on lending capital

BOD resolution on lending capital of Refrigeration Electrical Engineering Corporation as follows:

HOSE

>   AGG: Approving the stock issuance under ESOP (28/06/2024)

>   HAH: Result of stock issuance for capital increase (28/06/2024)

>   NTL: The record date for additional issue to increase the equity (28/06/2024)

>   TCD: Record date for stock issuance to raise capital (28/06/2024)

>   TCD: Approval for documents of share issuance to raise capital (28/06/2024)

>   TCD: Stock issuance for capital increase (28/06/2024)

>   TCD: Stock issuance plan for capital increase (28/06/2024)

>   ASM: Approval for documents of share issuance to pay dividend (28/06/2024)

>   PTD: Notice of record date for bonus share issue (28/06/2024)

>   TNG: Official Dispatch on share issue for 2023 dividend payment (28/06/2024)