Monday, 12/06/2023 10:51

BCM: BOD approves to issue bond

On June 02, 2023, The BOD of Investment and Industrial Development Joint Stock Corporation approved to issue bond as follows:

1)      Bond type: non-convertible bond

2)      Total value of bonds expected to issue: VND1,000 billion

3)      Maximum interest rate: 13%/year.

4)      Par value: VND100,000,000.

5)      Issue price: 100% of par value

6)      Number of bonds expected to issue: 10,000 bonds

7)      Currency unit: VND

8)      Bond term: 24 months

9)      Issue date: expected in June 2023

10)  Issue method: private placement.

HOSE

Other News

>   PDR: Result of bond repurchase before maturity (09/06/2023)

>   BAF: Information on the bond public offering via the website (09/06/2023)

>   VIC: Information on the bond public offering (09/06/2023)

>   GEX: Periodic report on bond principal & interest payments (09/06/2023)

>   KSB: Periodic report on bond principal & interest payments (08/06/2023)

>   KSB: Report on the use of capital of bonds (08/06/2023)

>   MSB: Periodic report on bond principal & interest payments (07/06/2023)

>   BAF: SSC received the documents of the 2nd bond public offering (07/06/2023)

>   CTG: Notice of the first bond public offering (07/06/2023)

>   TPB: Plan for bond private placement (07/06/2023)

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