BCM: Board resolution on a private placement of bonds

On March 08, 2021, the Board of Directors of Investment and Industrial Development Joint Stock Corporation approved the 2021 private placement of corporate bonds with the total issue value of 2,000 billion dongs):

-          Issuer: Investment and Industrial Development Joint Stock Corporation

-          Security type: none-convertible secured bond, without warrants

-          Bond type: book-entry

-          Issue method: private placement

-          Currency unit: dong

-          Issue volume: 2,000,000,000,000 dongs

-          Bond code: BCMH2126001

-          Par value: 1,000,000 dongs/bond

-          Issue price: 100% par value

-          Bond term: 05 years

-          Issue time: in Quarter I – II of 2021.

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