VIC11716: Record date for the fourth bond interest payment period

On June 13, 2019, the Hochiminh Stock Exchange issued Announcement No. 859/TB-SGDHCM about the record dated for the fourth bond interest payment period of VINGROUP Joint Stock Company as follows:

-       Ex-right date:      June 19, 2019

-       Record date:        June 19, 2019

1. Reason & Purpose: to pay for the fourh interest period of VIC11716 bond (from and including January 03, 2019 to but excluding July 03, 2019).
2. Content:

-       Interest rate:        11.05%/year

-       Payment amount: VND5,555.694 for 01 bond

-       Payment date:      July 03, 2019

-       Place of payment:

  + Shareholders whose bonds have been deposited: at the securities firms where the bonds have been deposited.

+ Shareholders whose bonds have not been deposited: at Techcom Securities Joint Stock Company (TCBS).

HOSE

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>   DXG: Result of the bond private placement (13/06/2019)

>   CII: Result of private placement of bonds (12/06/2019)

>   HNX: Trading results of Corporate bond on 11/06/2019 (12/06/2019)

>   SCR11816: Decision on the bond listing of SCR.BOND.2018 (10/06/2019)

>   CII11815: Decision on the bond listing of CII122019 Bond (10/06/2019)

>   Government bond futures contracts to be launched on July 4 (08/06/2019)

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>   PDR: BOD resolution on the plan for corporate bonds issuance (07/06/2019)