CII11709: The record date for bond interest payment

HOSE announces the record date for bond interest payment by Ho Chi Minh City Infrastructure Investment Joint Stock Company as follows:

-       Issuer: Ho Chi Minh City Infrastructure Investment Joint Stock Company

-       Bond name: Bond of Ho Chi Minh City Infrastructure Investment Joint Stock Company (CII_BOND2017-03)

-       Bond symbol:      CII11709

-       ISIN code:           VN0CII117096

-       Bond type:           corporate bond

-       Par value:            100,000 VND/bond

-       Bond term:          02 years

-       Issue date:                      July 26, 2017

-       Maturity date:      July 26, 2019

-       Interest rate:       

• The second year: the reference rate + 1%/year: 7.775%/year

-       Interest payment period: once every three months

-       Ex-right date:       April 12, 2019

-       Record date:        April 12, 2019

-       Purpose: to pay for the bond interest (from January 26, 2019 to April 26, 2019)

-       Exercise ratio:      1.944%/bond (1,944 VND/bond)

-       Payment date:      April 26, 2019

-       Place of payment:

• Bondholders whose bonds have been deposited: at the securities firms where the bonds have been deposited.
• Bondholders whose bonds have not been deposited: at Ho Chi Minh City Securities Corporation (5^th – 6^th Floor, AB Building, 76 Le Lai, district 1, HCMC) as from April 26, 2019.

HOSE

>   HQC: Result of the second phase of bond issuance (04/04/2019)

>   HQC: Result of the first phase of bond issuance (04/04/2019)

>   CII11709: Notice of bond interest payment (03/04/2019)

>   CMG: Result of private placement of bonds (02/04/2019)

>   VHM11726: The record date for the 3rd bond interest payment (02/04/2019)

>   SDI11717: The record date for the 3rd bond interest payment (02/04/2019)

>   TCH: Result of private placement of bonds (28/03/2019)

>   TCH: TCH allowed to issue bonds (28/03/2019)

>   SHS: Information disclosure about Board Resolution on approving the first phase of corporate bond issue for 2019 (27/03/2019)

>   PDR: PDR announces the plan for bond issuance (27/03/2019)