TCB: Transaction with a subsidiary
The Board of Directors of Vietnam Technological and Commercial Joint Stock Bank (Techcombank) approved a plan for selling corporate bonds to Techcombank’s subsidiary as follows:
Content
Plan
Bond
Bond code
Issuer
Issue date
Due date
Maximum volume
Maximum selling par price
(VND)
NPM082023
Nui Phao Mining Company Limited
08/13/2018
08/13/2023
4,000,000
400,000,000,000
Buyer
Techcom Bond Fund
Selling price
Not lower than the par value plus the bond interest rate accumulated until the selling date
Trading time
By the end of March 31, 2019
HOSE
> DMC: BOD resolution dated March 08, 2019 (11/03/2019)
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> BVG: Annual General Mandate 2019 (11/03/2019)
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> PLP: Announcement of change of the time for rights transference (11/03/2019)
> LCW: Annual General Mandate 2019 (11/03/2019)
> KSE: Board Resolution (11/03/2019)
> HNX: UPCoM Admission of HD8 (11/03/2019)
> HNX: UPCoM Admission of CSI (11/03/2019)
> DPG: DPG signs a construction contract (11/03/2019)
