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REE: Approving to plan for bonds issuance The Board resolution dated January 22, 2019, Refrigeration Electrical Engineering Corporation approved the following issues:
1. Approving the plan for the bond issuance:
- Issuer: Refrigeration Electrical Engineering Corporation
- Bond name: REE-BOND2029
- Bond type: non-convertible bond, secured and without warrants.
- Par value: VND1,000,000,000
- Expected issue volume: 2,320 bonds
- Issue price: 100% par value
- Total value (based on par value): VND2,320,000,000,000
- Number of phases of bond issuance: 01 phase
- Issue date: expected in Q1.2019
- Issue method: private placement
- Issue agency: Standard Chartered (Vietnam)
- Bond owner representative: Ho Chi Minh City Securities Corporation (HSC)
- Registration, transfer, principle and interest payment bond: Ho Chi Minh City Securities Corporation (HSC)
- The new bonds are freely transferable
- Issue currency: VND
- Term: 10 years
- Term of interest payment: 7.3%/year
- Interest payment method: Once every six months from the issue date.
2. Approving the Credit Guarantee and Investment Facility (CGIF) (a Trust Fund of Asian Development Bank) to be a guarantee for the company’s bond payment obligation (Guarantee) and mortgage the company's assets to secure the company’s obligations with CGIF under guarantee and bond conditions. HOSE
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