From October 24 to October 30, 2013, VINGROUP Joint Stock Company held road-shows to offer its bonds to international market, especially major financial centers such as Hong Kong, Singapore, London, Los Angeles, Boston and New York. After that, VINGROUP completed necessary procedures to close transactions and transferred its bonds to investors on November 07, 2013.
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Therefore, VINGROUP reported the result of bond offering as
follows:
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Bond name: Bond of VINGROUP Joint Stock Company
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Bond type: without warrant
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Currency: US Dollar
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Estimated issue value: US$200 million
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Real issue value: up to US$200 million
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Issue price: 99.147% of par value
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Market: international market
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Bond term: 4.5 years
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Coupon: 11.625%/year
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Interest payment period: every 6 months
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Interest payment method: in US$
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Maturity date: May 07, 2018
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Record date: October 31, 2013
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Issue date, installment date and transfer date: November 07,
2013
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Listing of bonds: The bonds are listed on SGX-ST.
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Listing date: November 14, 2013
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Depository of bonds: The Depository Trust Company
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Number of investors: 93 investors (In total of 100% of bonds
issued, 66% is distributed to investment funds, 25% is distributed to banks
managing private assets, and 9% is distributed to other banks and organizations).
