CII11709: Record date for interest and principal payment of CII_BOND2017-03

Hochiminh Stock Exchange announces the record date for bond interest and principal payment as follows:

-       Bond name: Bond of Ho Chi Minh City Infrastructure Investment Joint Stock Company (CII_BOND2017-03)

-       Bond code: CII11709

-       ISIN code: VN0CII117096

-       Bond type: corporate bond

-       Par value: VND100,000

-       Bond term: 02 years

-       Issue date: July 26, 2017

-       Maturity date: July 26, 2019

-       Purpose: to pay interest (from April 26, 2019 to July 26, 2019) and principal on the maturity date of July 26, 2019.

-       Payment amount: VND101,953/bond

-       Record date:        July 12, 2019

-       Payment date:      July 26, 2019

-       Place of payment:

• For bondholders whose bonds have been deposited: Bondholders will fulfill procedures to receive bond interest and principal at the securities firms where the bonds have been deposited.
• For bondholders whose bonds have not been deposited: The bond interest and principal will be paid to the bondholders’ accounts which were registered at Ho Chi Minh City Securities Corporation (Floor 5-6, AB Building, 76 Le Lai, district 1, HCMC) from July 26, 2019.

HOSE

>   PNJ: Resolution on the dividend payment (04/07/2019)

>   VPH: Notice of change of dividend payment date (04/07/2019)

>   KBC: Report on bond interest & principal payment of KBCBOND2019-01 (04/07/2019)

>   KBC: Report on bond interest & principal payment of KBCBOND04-2017 (04/07/2019)

>   IRC: Notice of record date for dividend payment of 2018 in cash (03/07/2019)

>   TSG: Board decision on approving the plan to pay dividend of fiscal year 2018 and Announcement of the record date for 2018 dividend payment (03/07/2019)

>   S12: Change time to pay dividend (03/07/2019)

>   VPH: Notice of change of dividend payment date (03/07/2019)

>   TEG: Result of share issue for dividend payment (03/07/2019)

>   PC1: Result of share issue for dividend payment (03/07/2019)